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DATA SHEET
SAA1305T On/off logic IC
Product specification Supersedes data of 1998 Sep 04 2004 Jan 15
Philips Semiconductors
Product specification
On/off logic IC
FEATURES * 8 accurate Schmitt trigger inputs with clamp circuits * Very low quiescent current * Reset generator circuit * Changed information output * On/off output to control a regulator IC which supplies the microcontroller * 32.768 kHz RC oscillator and/or a 32.768 kHz crystal oscillator * No delayed reset needed (start-up behaviour oscillator fixed by internal logic) * Watchdog timer function * Blinking LED oscillator with drive circuit for LED * Watch function. GENERAL DESCRIPTION The SAA1305T is an on/off logic IC, intended for use in car radios to interface between a microcontroller and various input signals such as ignition, low supply detection, on/off key and external control signals. QUICK REFERENCE DATA SYMBOL VDD Iq fSCL(max) Tvj PARAMETER supply voltage quiescent supply current maximum SCL clock frequency virtual junction temperature CONDITIONS operating MIN. 4.5 - -
SAA1305T
The SAA1305T can replace an existing on/off logic built-up with discrete components. The SAA1305T contains 8 inputs with accurate Schmitt triggers and clamp circuits. The main function of this IC is an intelligent I/O expander with 2 modes of operation: 1. Normal I/O expander: the microcontroller (master) is running and the SAA1305T acts like a slave. 2. Sleep mode of the total application: the microcontroller is stopped and the SAA1305T acts like a master. During an event, the microcontroller is awakened. The communication with the IC is performed via the I2C-bus (400 kHz). Extra functions of the SAA1305T are: * LED blinker circuit * One-day watch * Watchdog timer.
TYP. 5.0 130 - -
MAX. 5.5 200 400 150
UNIT V A kHz C
VDD = 5 V; standby mode -
ORDERING INFORMATION PACKAGE TYPE NUMBER NAME SAA1305T SO24 DESCRIPTION plastic small outline package; 24 leads; body width 7.5 mm VERSION SOT137-1
2004 Jan 15
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Philips Semiconductors
Product specification
On/off logic IC
BLOCK DIAGRAM
SAA1305T
handbook, full pagewidth
D0 D1 D2 D3 D4 D5 D6 D7
1 2 3 4 5 6 7 8 STATUS VL TIMER WATCH TIMER ALARM TIMER WATCHDOG TIMER OSCILLATOR LED DRIVER 22 LED SUPPLY 10 RES VDD 21 19 16 17 14 15 ERROR COUNTER 13
MGR200
COMPARATOR
MASK RESET GENERATOR
24 23 9
CHI RP ON/OFF
NEW LATCH
OLD LATCH
SAA1305T
12
TS
SDA SCL
18 20 I2C-BUS INTERFACE
11
WD
VSS
XTAL2 XTAL1
OSC2
TST
OSC1
Fig.1 Block diagram.
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Philips Semiconductors
Product specification
On/off logic IC
PINNING SYMBOL D0 D1 D2 D3 D4 D5 D6 D7 ON/OFF RES WD TS TST OSC1 OSC2 XTAL1 XTAL2 SDA VSS SCL VDD LED RP CHI Note 1. The following results in a LOW-level voltage on pin CHI: a) A change on any of the (non-masked) inputs D0 to D7. b) A device reset. c) An alarm or VL timer event. d) An oscillator fault or a failed I2C-bus read sequence after a change information signal. e) A failed Watchdog timer trigger sequence. PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 DESCRIPTION
SAA1305T
input D0; generates a reset pulse on pin RP and a LOW-level voltage on pin CHI input D1; generates a reset pulse on pin RP and a LOW-level voltage on pin CHI input D2; generates a reset pulse on pin RP and a LOW-level voltage on pin CHI input D3; generates a reset pulse on pin RP and a LOW-level voltage on pin CHI input D4; generates a reset pulse on pin RP and a LOW-level voltage on pin CHI input D5; generates a reset pulse on pin RP and a LOW-level voltage on pin CHI input D6; generates a reset pulse on pin RP and a LOW-level voltage on pin CHI input D7; generates a reset pulse on pin RP and a LOW-level voltage on pin CHI on/off output (off is active LOW); for controlling the enable of a separate power supply IC from the microcontroller reset input (active LOW); for power-on or system reset for the IC Watchdog timer trigger input signal from the microcontroller timer start input (active LOW); to trigger the VL (is an undervoltage) timer (250 ms) test purpose input; must be connected to VSS RC oscillator output (32.768 kHz) RC oscillator input (32.768 kHz) crystal oscillator output (32.768 kHz) crystal oscillator input (32.768 kHz) I2C-bus serial data input/output; interface to the microcontroller ground supply (0 V) I2C-bus serial clock line input; interface to the microcontroller supply voltage; 5 V 10% with a current consumption of maximum 200 A (without LED current) light emitting diode output; to drive a LED up to 20 mA (high side switch to VDD) reset pulse output change information output (active LOW); note 1
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Philips Semiconductors
Product specification
On/off logic IC
Reset time
SAA1305T
handbook, halfpage
D0 1 D1 2 D2 3 D3 4 D4 5 D5 6
24 CHI 23 RP 22 LED 21 VDD 20 SCL 19 VSS
The pulse time on pin RP is selectable via an I2C-bus command; see Table 8. The default value after Power-on reset is the longest time (20 ms). Selectable pulse times via the control register are: 1, 5, 10 and 20 ms. With the rising edge of the reset pulse all inputs, except the Watchdog timer and VL timer, are disabled until the I2C-bus command ENABLE-RESET. Each pulse on pin RP resets the internal I2C-bus interface. On/off The output signal on pin ON/OFF remains HIGH after a trigger event. Trigger sources are: * Alterations on any of the inputs D0 to D7 * An impedance detection * A device reset * A VL (is an undervoltage) timer or alarm timer event * An oscillator fault. In the event of a five time failed Watchdog timer trigger or missed I2C-bus read sequence (after a change information indication), an internal logic circuit will reset pin ON/OFF and set the IC in the standby mode. It is also possible to control pin ON/OFF during the run mode via an I2C-bus command (see Table 8, bit 1). In principal two stable IC modes are possible; see Fig.3: 1. Standby mode: an oscillator fault and the following IC function groups can trigger a reset pulse to enter the run mode; a) Watch (alarm timer). b) Supply (device reset). c) Inputs D0 to D7 (a change on any of these inputs or an impedance detection). The Watchdog timer and the VL timer are disabled in the standby mode. 2. Run mode: only the Watchdog timer (WD), an oscillator fault, a missed I2 C-bus communication and the reset input (RES) can trigger a reset pulse. It is possible to enter the standby mode via control register bit 0; see Table 8. The dynamic mode or wait mode is possible but can only be started from the run mode (see Section "VL timer").
SAA1305T
D6 7 D7 8 ON/OFF 9 RES 10 WD 11 TS 12
MGR201
18 SDA 17 XTAL2 16 XTAL1 15 OSC2 14 OSC1 13 TST
Fig.2 Pin configuration.
FUNCTIONAL DESCRIPTION Figure 1 shows the block diagram for the SAA1305T. Details are explained in the subsequent sections. Watch and alarm functions An internal RAM (watch register) counts automatically the seconds for one-day (one-day reset also automatically). The watch register can be set and read from the I2C-bus. An alarm function is possible via a second RAM (alarm register) and is programmable via the I2C-bus. The alarm timer triggers pin CHI and if enabled the reset pulse on pin RP. After a device reset the content of the alarm register is FFFFH (alarm function is disabled) and the content of watch register is 0000H. LED control The I2C-bus interface control (see Table 10) for the LED contains: * Two function control bits * Two control bits for the blink LED frequency * Two control bits for the blink LED duration time. All bits are combined within the LED register. 2004 Jan 15 5
Philips Semiconductors
Product specification
On/off logic IC
SAA1305T
handbook, full pagewidth
SAA1305T
OPERABLE RES = HIGH I2C-bus error counter = 5 Watchdog timer error counter = 5 RUN RESET entry(1) event(2) event(3); CHI control register bit 0 STANDBY entry(4) event(5)
VL timer start VL timer end input D0 = logic 1 RES = LOW oscillator fault
WAIT entry(6) event(5)
MGR202
(1) (2) (3) (4) (5) (6)
See Section "Run mode entries". See Section "Run mode events". Possible events are: alterations on any of the inputs D0 to D7, an impedance detection, an alarm timer event and an oscillator fault. See Section "Standby mode entries". Not available. See Section "Wait mode entries".
Fig.3 State diagram for IC modes.
RUN MODE ENTRIES * Reset Watchdog timer error counter * Enable Watchdog timer * Enable VL timer function * Generate reset pulse * Disable reset generation via inputs D0 to D7 changes (inclusive impedance detection) and watch compare * Reset I2C-bus interface * Set pin CHI to LOW (LOW = active) * Set pin ON/OFF to HIGH (ON is active). RUN MODE EVENTS * I2C-bus read and write commands * Watchdog timer reset * Missed I2C-bus communication after a (CHI) change information signal * Oscillator fault.
WAIT MODE ENTRIES * Disable Watchdog timer * Reset I2C-bus error counter * Reset Watchdog timer error counter * Start VL timer * Set pin CHI in 3-state * Set pin ON/OFF to LOW (OFF is active). STANDBY MODE ENTRIES * Disable Watchdog timer * Reset Watchdog timer error counter * Reset I2C-bus error counter * Disable VL timer function * Enable reset generation via inputs D0 to D7 changes (inclusive impedance detection) and watch compare * Set pin ON/OFF to LOW (OFF is active) * Set pin CHI in 3-state.
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Philips Semiconductors
Product specification
On/off logic IC
Serial I/O interface (slave) operates The hardware of the with a maximum clock frequency of 400 kHz. Inputs Pins D0 to D7 are connected to latches (new register). Each latch contains and stores the input change until the read out via the I2C-bus (read out of new register). A second register (old register, latches) contains the input situation before a `reset pulse' signal or HIGH-to-LOW transition of pin CHI. After a level change on any of the inputs D0 to D7 (content of new register into `old' register), pin CHI will indicate this event. Reading the `old' register has no influence on any latch content. Reading the new register will shift the content into the old register. During the I2C-bus read sequence of the new register the latch content will be shifted into the corresponding old latch and afterwards the new latches are enabled until the next change on this input. The functions of the inputs D0 to D7 are shown in Table 1. Table 1 Input logic levels and functions SCHMITT TRIGGER INPUT X X X - - - X X SPECIAL INPUT - - - X X X - - MASKABLE X X X X - - - - VL TIMER INTERRUPT - - - - - - - X I2C-bus
SAA1305T
Due to the fact, that a `reset pulse' signal or a `change information' signal are also possible via the Watchdog timer, VL timer, alarm timer, impedance detection, oscillator fault or after a device reset, the information about these different events is also available via corresponding bits within the status register; see Table 5. A status I2C-bus read sequence resets the status register and pin CHI. Only after a change on any of the inputs D0 to D7, an I2C-bus read sequence of the status register, old register and new register is it necessary to reset pin CHI. The inputs D4 to D7 are maskable via the I2C-bus; see Table 8. All masked inputs (defined via the control register) are blocked to trigger pins CHI and RP. During the disable phase of the masked inputs the corresponding bits within the old and new registers will be continuously refreshed with the actual input level.
INPUT D7 D6 D5 D4 D3 D2 D1 D0
IMPEDANCE DETECTION - - - - - - X -
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Philips Semiconductors
Product specification
On/off logic IC
IMPEDANCE DETECTION Input D1 is a normal input with comparable behaviour like the other seven inputs. The only difference is an additional internal exclusive-NOR (EXNOR) connected between the two comparator outputs for high and low detection; see Fig.4. The EXNOR signal indicates, in combination with a special external circuit on input D1, a voltage of 1 V 2 DD on this input. The simple input description for impedance detection is probably not the real solution, but helps to explain the function. Input D1 can be used as a normal input and for impedance detection as described in Table 2. For normal use the output Q acts like every other input, but for impedance detection the EXNOR output S is also important. Output S is linked to the status register bit 6 and indicates the 12VDD; see Table 5.
SAA1305T
Between detection and indication via the status register bit 6, a delay time is integrated (programmable via the impedance register bits 1 and 0; see Table 15). When the 1 V 2 DD value is detected the EXNOR output will be set to logic 1 (active) and after the programmed delay time the status register bit 6 will be set to logic 1 (active). This event will also be indicated via pin CHI and (if enabled) pin RP. The impedance information (bit 6 is active) within the status register is present until the I2C-bus status is read. With the disappearance of the impedance information no further actions will be generated. Every impedance signal change during the delay time will restart the delay time. However an impedance detection is only possible in the event of a stable signal, at least for the programmed delay time. Setting the status register bit 6 with a repetition time which equals the `impedance delay time' as long as input D1 stays in high-impedance state is implemented.
handbook, full pagewidth
12 V ignition key 10 k
5V O1 100 k input D1 100 k O2 1.5 V
MGR203
3.5 V
S Q R
S
Fig.4 Simple input description for impedance detection.
Table 2
Logic levels for impedance detection IGNITION KEY O1 1 0 0 O2 0 0 1 Q 1 0 or 1 0 S 0 1 0
12 V Open-circuit (VI = 2.5 V) Ground (VI < 1.5 V)
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Philips Semiconductors
Product specification
On/off logic IC
Watchdog timer An internal Watchdog timer is active after each reset pulse output and can be triggered via pin WD. In the event of a not specified pulse, a delayed or missing trigger pulse, a reset on pin RP will be the immediate reaction.
SAA1305T
After the HIGH-to-LOW transition of the reset pulse output, the first transition change within 500 ms on pin WD will be detected as the first trigger from the microcontroller. The timing diagram for the Watchdog timer trigger signal is shown in Fig.5.
handbook, halfpage
RP
WD
(1)
(2)
(3)
MGR220
(1) In the event of a not specified, a delayed or missing trigger signal, a reset on pin RP will be the immediate reaction. (2) The maximum time until signal change for first Watchdog timer is 500 ms. (3) The time until next signal change is minimum 200 ms and maximum 300 ms.
Fig.5 Watchdog timer trigger timing.
Oscillators Two oscillator types are built-in, a RC oscillator (designed for 32.768 kHz) and a crystal oscillator (32.768 kHz), both with separate pins. For a proper device function an oscillator control circuit is integrated. This circuit supervises the oscillator function and creates a reset and oscillator restart in the event of an oscillator failure. In the event of an oscillator fault, the event will be indicated after a restart via the status register bit 5. During the oscillator failure phase some outputs remain at a defined level as shown in Table 3. The RC oscillator accuracy is 5%. When operating with the RC oscillator, pin XTAL2 must be connected to VDD or VSS to minimize the quiescent current. When operating with the crystal oscillator pin OSC2 must be connected to VSS or VDD.
VL timer A built-in timer, which can be started with a HIGH-to-LOW transition on pin TS, triggers, after 250 ms, pins RP and CHI and sets pin ON/OFF. The VL timer starts only once after a valid start condition. Default state after a Power-on reset is not active. A VL timer start resets the Watchdog timer. During run time of the VL timer is ON/OFF = LOW, CHI = 3-state and the Watchdog timer is disabled. Pin TS is only active during the run mode. During run time of the VL timer the IC remains in the wait mode. Only a HIGH-level signal on input D0 can stop the VL timer in the same way as after 250 ms. In the event of an oscillator fault the IC also enters the run mode but without an influence on the status register bit 2. During the wait mode an influence of the status register via other sources (e.g. timer and inputs) is possible, but a transition from wait mode to run mode is only possible as described above.
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Philips Semiconductors
Product specification
On/off logic IC
Power-on or system reset The reset input (pin RES) is of the CMOS input levels type. During a LOW level on pin RES the outputs are as shown in Table 3 for RES = LOW. Table 3 Logic levels for the reset input and oscillator failure PIN RP ON/OFF LED SDA CHI Table 4 RES = LOW HIGH LOW LOW 3-state 3-state RES = HIGH HIGH (voltage on VDD) 3-state [after a defined time (maximum reset time)] HIGH LOW 3-state (receiving mode if RP = LOW) LOW (information for microcontroller)
SAA1305T
After the system reset (rising edge on pin RES) all internal registers are in a defined condition (see Table 4) and the outputs are as shown in Table 3 for RES = HIGH.
OSCILLATOR FAILURE 3-state LOW LOW 3-state LOW
Defined condition after reset for the registers; RES = HIGH CONTENTS 02 (HEX) all input latches are enabled same levels as corresponding inputs during falling edge on pin RES 03 (HEX) 04 (HEX) FFFF (HEX); see Table 7 0000 (HEX)
REGISTER Status register New register Old register Control register LED register Alarm register Watch register
Impedance register 03 (HEX)
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Philips Semiconductors
Product specification
On/off logic IC
I2C-BUS INTERFACE COMMANDS I2C-bus communication is only possible in the run mode. Read mode operations Only the sequential read mode is possible. The IC starts after every device select (code 48) to output data 1. However, in this event the master does acknowledge the data output and the IC continues to output the next data in sequence; see Figs 6 and 7.
SAA1305T
To terminate the stream of bytes, the master must not acknowledge the last byte output, but must generate a STOP condition. The output data is from consecutive byte addresses, with the internal byte address counter automatically incremented after each byte output. In the event of higher read sequences than available data bytes, the 7th and 8th bit content are 0 and the address counter will generate a wrap around (output at address 0). The definitions of the bits are given in Tables 5, 6 and 7.
handbook, full pagewidth
acknowledge
acknowledge
acknowledge
no acknowledge
S
DEVICE SELECT
DATA 1
DATA N
P
START condition
R/W
STOP condition
MGR221
Fig.6 I2C-bus read mode sequence.
handbook, full pagewidth
START
DEVICE SELECT byte
STATUS 0
OLD 1
NEW 2
WATCH 3, 4, 5, 6, 7
STOP
MGR222
Fig.7 I2C-bus read data sequence.
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Philips Semiconductors
Product specification
On/off logic IC
Table 5 BIT 7 6 5 4 3 2 1 0 Table 6 BIT 7 6 5 4 3 2 1 0 Table 7 data of input D7 data of input D6 data of input D5 data of input D4 data of input D3 data of input D2 data of input D1 data of input D0 Definition of the watch and alarm register bits (read mode); note 1 DATA BITS 4 to 0 5 to 0 5 to 0 4 to 0 5 to 0 5 to 0 DESCRIPTION hours of alarm minutes of alarm seconds of alarm hours of watch minutes of watch seconds of watch VALUES 0 to 31 0 to 63 0 to 63 0 to 23 0 to 59 0 to 59 Definition of the status register bits DESCRIPTION a logic 1 indicates a change on any of the inputs D7 to D0 a logic 1 indicates a 12VDD on input D1 (impedance detection) a logic 1 indicates a reset after an oscillator fault
SAA1305T
a logic 1 indicates a reset caused by a missed I2C-bus communication after a change information signal (no communication between two Watchdog timer trigger pulses) a logic 1 indicates a timer alarm a logic 1 indicates a VL timer reset a logic 1 indicates a device reset (via pin RES) a logic 1 indicates a Watchdog timer reset Definition of the old and new register bits DESCRIPTION
ADDRESS (HEX) 2 3 4 5 6 7 Note
DEFAULT 31 63 63 0 0 0
1. The alarm is disabled by writing a time larger than 24:00:00. With the default values the alarm function is disabled.
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Philips Semiconductors
Product specification
On/off logic IC
Write mode operations After a START condition the master sends a device select code with the R/W bit reset to logic 0; see Fig.8. The IC acknowledge this and waits for the address byte. After the address the master sends the corresponding data, which is acknowledged by the IC. It is possible to continue with the data transfer, each byte is acknowledged by the IC. The internal byte address counter is incremented after each data transmission.
SAA1305T
The transfer is terminated when the master generates a STOP condition. In the event of a wrong address decoding the IC sends a no acknowledge signal and ignores all following data. Figure 9 shows the sequence for write data mode. Both alarm and watch registers consist of 3 bytes. The first byte (2 and 5) is the most significant byte. The definitions of the bits are given in Tables 8, 10, 14 and 15.
handbook, full pagewidth
acknowledge
acknowledge
acknowledge acknowledge
acknowledge
S
DEVICE SELECT
ADDRESS
DATA 1
DATA N
P
START condition
R/W
MGR223
STOP condition
Fig.8 I2C-bus write mode sequence.
handbook, full pagewidth
START
DEVICE SELECT
ADDRESS byte
CONTROL 0
LED 1
ALARM 2, 3, 4
WATCH 5, 6, 7
IMPEDANCE 8
STOP
MGR224
Fig.9 I2C-bus write data sequence.
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Philips Semiconductors
Product specification
On/off logic IC
Table 8 BIT 7 6 5 4 3 2 1 0 Definition of the control register bits DESCRIPTION
SAA1305T
part of the mask register; corresponds to input D7; a logic 1 disables input D7 (no influence on pin CHI) part of the mask register; corresponds to input D6; a logic 1 disables input D6 (no influence on pin CHI) part of the mask register; corresponds to input D5; a logic 1 disables input D5 (no influence on pin CHI) part of the mask register; corresponds to input D4; a logic 1 disables input D4 (no influence on pin CHI) content of bits 3 and 2 corresponds with the pulse width of the reset pulse output; see Table 9 control bit for pin ON/OFF; a logic 0 sets pin ON/OFF to VSS; a logic 1 sets pin ON/OFF to VDD control bit (ENABLE-RESET) for the IC modes; only setting a logic 0 is possible; standby mode with disabled Watchdog timer, enabled reset generation, ON/OFF = LOW and CHI = 3-state; with the rising edge of the reset pulse output the IC enters the run mode with enabled Watchdog timer, disabled reset generation, ON/OFF = HIGH (but controllable via control register bit 1) and CHI = HIGH (is active, not in 3-state) Pulse width of the reset pulse output BIT 2 0 1 0 1 PULSE WIDTH (ms) 20 10 5 1 Table 12 Control bits for the blink LED frequency BIT 3 0 0 1 1 BIT 2 0 1 0 1 FREQUENCY 2 Hz (0.5 s) 1 Hz (1 s) 0.67 Hz (1.5 s) 0.5 Hz (2 s)
Table 9 BIT 3 0 0 1 1
Table 10 Definition of the LED register bits BIT 7 6 5 4 3 2 1 0 DESCRIPTION bits 7 and 6 are function control bits; see Table 11 no function reset I2C-bus error counter bits 3 and 2 are control bits for the blink LED frequency (output LOW time); see Table 12 bits 1 and 0 are control bits for the blink LED duration time; see Table 13
Table 13 Control bits for the blink LED duration time BIT 1 0 0 1 1 BIT 0 0 1 0 1 DURATION TIME (ms) 20 30 40 50
Table 11 Function control bits BIT 7 0 0 1 1 BIT 6 0 1 0 1 FUNCTION LED output switched to ground blink function according the LED register bits 0 to 3 LED output switched to VDD blink function according the LED register bits 0 to 3
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Philips Semiconductors
Product specification
On/off logic IC
Table 14 Definition of the watch and alarm register bits (write mode); notes 1, 2 and 3 ADDRESS (HEX) 2 3 4 5 6 7 Notes DATA BITS 4 to 0 5 to 0 5 to 0 4 to 0 5 to 0 5 to 0 DESCRIPTION hours of alarm minutes of alarm seconds of alarm hours of watch minutes of watch seconds of watch VALUES 0 to 31 0 to 63 0 to 63 0 to 23 0 to 59 0 to 59
SAA1305T
DEFAULT 31 63 63 0 0 0
1. The alarm is disabled by writing a time larger than 24:00:00. With the default values the alarm function is disabled. The alarm is also disabled if hours >23 or minutes >59 or seconds >59. 2. There are several attention points if a senseless time is written to the alarm register, for example: a) Write 25 to address 2; data bits 4 to 0 = 25 hours = 25 (alarm disabled). b) Write 70 to address 3; data bits 5 to 0 = 6 minutes = 6. c) Write 81 to address 4; data bits 5 to 0 = 17 seconds = 17. 3. There are several attention points if a senseless time is written to the watch register, for example: a) Write 25 to address 5; data bits 4 to 0 = 25 hours = 23 (limited). b) Write 70 to address 6; data bits 5 to 0 = 6 minutes = 6. c) Write 81 to address 7; data bits 5 to 0 = 17 seconds = 17. Table 15 Definition of the impedance register bits BIT 7 6 5 4 3 2 no function no function no function no function no function enable or disable bit for the impedance detection 0 = inactive (12VDD detection without influence on the status register) 1 = active (12VDD detection with influence on the status register) 1 0 Table 16 Control bits for the impedance detection delay time BIT 1 0 0 1 1 BIT 0 0 1 0 1 DELAY TIME 100 ms 250 ms 500 ms 1s bits 1 and 0 are control bits for the impedance detection delay time; see Table 16 DESCRIPTION
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Philips Semiconductors
Product specification
On/off logic IC
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VDD Iq VI(n) PARAMETER supply voltage quiescent supply current input voltage on pins SDA, SCL, RES, WD and TS D0 to D7 VO(n) fSCL(max) Tvj Tstg Tamb output voltage on pins CHI, RP, ON/OFF and LED maximum SCL clock frequency virtual junction temperature storage temperature ambient temperature with 5 k series resistor fosc = 32 kHz operating VDD = 5 V; standby mode fosc = 32 kHz -0.5 -0.5 -0.5 - - -65 -40 CONDITIONS - MIN. -0.5
SAA1305T
MAX. +6.5 200 +6.5 +17 +6.5 400 150 +150 +85
UNIT V A V V V kHz C C C
THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient in free air CONDITIONS VALUE 78 UNIT K/W
CHARACTERISTICS VDD = 5 V; Tamb = 25 C; unless otherwise specified. SYMBOL Supply VDD Iq Inputs PINS D0 TO D7 Vi(clamp) Iclamp(h) ILI Vth(r) Vth(f) Vhys Vth(r) Vth(f) Vhys input clamping voltage high clamping current input leakage current Iclamp = 2 mA VD0 to VD7 >VDD VDx = 5 V 5.5 - - 3.4 1.4 1.8 6.5 - - 3.5 1.5 2 8.3 2 1 V mA A V V V supply voltage quiescent supply current operating note 1 4.5 - 5.0 130 5.5 200 V A PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
SCHMITT TRIGGER INPUTS FOR PINS D0, D1 AND D5 TO D7 rising threshold voltage falling threshold voltage hysteresis voltage 3.6 1.6 2.2
SPECIAL INPUTS FOR PINS D2, D3 AND D4 rising threshold voltage falling threshold voltage hysteresis voltage 2.4 1.7 0.5 2.5 1.8 0.7 2.6 1.9 0.9 V V V
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Philips Semiconductors
Product specification
On/off logic IC
SAA1305T
SYMBOL PIN SCL VIL VIH ILI fSCL(max) ti(r) ti(f) Ci VIL VIH ILI Ci
PARAMETER
CONDITIONS
MIN. - - - -
TYP.
MAX.
UNIT
LOW-level input voltage HIGH-level input voltage input leakage current maximum SCL clock frequency input rise time input fall time input capacitance Vi = 5 V; with output off
0 3 - - - - - 0 0.8VDD Vi = 5 V; with output off - -
1.5 VDD 1 400 - - 7
V V A kHz s s pF
tbf tbf - - - - -
PINS RES, WD AND TS LOW-level input voltage HIGH-level input voltage input leakage current input capacitance 0.2VDD VDD 1 7 V V A pF
Inputs/outputs PIN SDA VIL VIH VOL Ioff ti(r) ti(f) to(f) Ci CL Pdr CL Rs fosc Q LOW-level input voltage HIGH-level input voltage LOW-level output voltage 3-state off current input rise time input fall time output fall time input capacitance load capacitance 1 V Vi 3 V IOL = 3 mA Vi = 5 or 0 V 0 3 0 - - - - - - - - - - - 100 5 Cosc = 300 pF; Rosc = 90 k; note 5 note 6 - - - - - - - - - - - 10 7 to 12 40 32.768 40000 1.5 VDD 1 10 2 2 200 7 400 - - - - 100000 - - - 10 V V V A s s ns pF pF W pF k kHz
CRYSTAL OSCILLATOR; notes 2 and 3; see Fig.10 drive level power load capacitance series resistance oscillator frequency Q factor
RC OSCILLATOR; note 4; see Fig.11 Cosc Rosc fosc fclk(min) oscillator capacitance oscillator resistance oscillator frequency minimum clock frequency 300 90 32.768 - pF k kHz kHz
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Philips Semiconductors
Product specification
On/off logic IC
SAA1305T
SYMBOL Outputs PIN LED VOL VOH IOH VOL VOH PIN CHI VOL ILO PIN RP VOH Ioff Notes
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
LOW-level output voltage HIGH-level output voltage HIGH-level output current
IOL = 16 mA IOL = 16 mA VOH > 1 V IOL = 4 mA IOH = -600 A IOH = -4 mA
0 4 -20 0 4.8 4
- - - - - - - - - -
0.5 VDD - 0.5 VDD VDD 0.5 5
V V mA
PIN ON/OFF LOW-level output voltage HIGH-level output voltage V V V
LOW-level output voltage output leakage current
IOL = 200 A VOH = VDD IOH = -4 mA Vo = VDD or VSS
0 - 4 -
V A V A
HIGH-level output voltage 3-state off current
VDD 5
1. The IC is programmed to standby mode via the I2C-bus command, no LED is connected, no I2C-bus communication, one oscillator is running and the Watchdog timer is disabled. 2. When running on crystal oscillator, the input of the RC oscillator must be connected to VDD or VSS. 3. Preferable crystal types: MU206S and DMX38. 4. When running on RC oscillator, the input of the crystal oscillator must be connected to VDD or VSS. 0.87 5. The RC oscillator frequency f osc = -----------------------------R osc x C osc The RC oscillator frequency tolerance f osc = R osc + C osc + ( 0.05 x f osc )
2 2 2
6. Below this maximum value the IC will detect an oscillator fault.
2004 Jan 15
18
Philips Semiconductors
Product specification
On/off logic IC
APPLICATION CIRCUITS
SAA1305T
handbook, full pagewidth
VDD input D7 input D4 R3 25 k R1 33 k 1 2 3 4 5 6 7 8 18 20 22 R5 1 k C1 15 pF 10 21 19 16 17 14 15 13 24 23 9 R4 1 k
SAA1305T
12
R2 20 k
11
(1)
C2 15 pF
MGR204
(1) Crystal oscillator type MU206S (32.768 kHz).
Fig.10 Application circuit for crystal oscillator.
handbook, full pagewidth
VDD input D7 input D4 R3 25 k R1 33 k 1 2 3 4 5 6 7 8 18 20 22 R5 1 k 10 21 19 16 17 14 15 13 24 23 9 R4 4.7 k
SAA1305T
12
R2 20 k
11
Rosc 90 k Cosc 300 pF
MGR205
Fig.11 Application circuit for RC oscillator.
2004 Jan 15
19
Philips Semiconductors
Product specification
On/off logic IC
ON/OFF LOGIC WITH MICROCONTROLLER IN POWER-DOWN STATE
14 V handbook, full pagewidth 5V RES
SAA1305T
5V CONTINUOUS REGULATOR
21 9 10 23 11
ON/OFF RP WD CHI SDA SCL MICROCONTROLLER
SAA1305T
24 D0 to D7 18 1 to 8 20
MGR206
Fig.12 Block diagram with continuous microcontroller supply.
handbook, full pagewidth
14 V
RES
Dx
ON/OFF
RP
CHI
ON/OFF
RP
CHI
WD
(1)
WD
(1)
MGR207
a. First power-on.
(1) Level not defined.
b. Normal switch-on.
Fig.13 Timing diagrams with continuous microcontroller supply.
2004 Jan 15
20
Philips Semiconductors
Product specification
On/off logic IC
Scenarios for ON/OFF logic with microcontroller in power-down state
SAA1305T
5 V continuous handbook, full pagewidth regulator RES = LOW 220 ms (hardware specific) RES = HIGH
SAA1305T RP = HIGH
microcontroller
ON/OFF = HIGH (A/D supply) CHI = LOW RP = LOW I2C-bus read status/old/new register CHI = HIGH I2C-bus write reset time/blink/LED status I2C-bus write ENABLE-RESET
MGR208
20 ms
Fig.14 Proper first connection on power supply.
SAA1305T handbook, full pagewidth Dx RP = HIGH ON/OFF = HIGH 1 ms CHI = LOW RP = LOW I2C-bus read status/old/new register CHI = HIGH WD = LOW 250 ms WD = HIGH 250 ms WD = LOW
microcontroller
main supply
POWER-ON
MGR209
Fig.15 Switch-on after a valid input change.
2004 Jan 15
21
Philips Semiconductors
Product specification
On/off logic IC
SAA1305T
handbook, full pagewidth
SAA1305T
microcontroller POWER-OFF TS = LOW
main supply
input D0 = LOW
250 ms
ON/OFF = LOW RP = HIGH CHI = LOW
1 ms ON/OFF = HIGH RP = LOW I2C-bus read status register CHI = HIGH TS = LOW 250 ms ON/OFF = LOW RP = HIGH CHI = LOW 1 ms ON/OFF = HIGH RP = LOW
MGR210
sequence runs untill signal input D0 = HIGH
Fig.16 VL timer behaviour (voltage drops >250 ms).
handbook, full pagewidth
SAA1305T
microcontroller POWER-OFF TS = LOW
main supply
input D0 = LOW
t < 250 ms input D0 = HIGH
ON/OFF = LOW RP = HIGH CHI = LOW
1 ms
ON/OFF = HIGH RP = LOW I2C-bus read status/old/new register CHI = HIGH WD = LOW
250 ms WD = HIGH 250 ms WD = LOW
MGR211
POWER-ON
Fig.17 VL timer behaviour (voltage drops <250 ms).
2004 Jan 15
22
Philips Semiconductors
Product specification
On/off logic IC
SAA1305T
handbook, full pagewidth
SAA1305T I2C-bus write alarm timer I2C-bus write ENABLE-RESET
microcontroller
main supply
POWER-OFF
programmable time
ON/OFF = LOW (A/D supply is off) RP = HIGH ON/OFF = HIGH (A/D supply is on)
1 ms
CHI = LOW RP = LOW I2C-bus read status/old/new register CHI = HIGH Watchdog timer trigger sequence(1) POWER-ON
MGR212
(1) See Fig.5.
Fig.18 Wake-up via alarm.
handbook, full pagewidth SAA1305T
microcontroller CHI = LOW WD = HIGH (LOW) WD = LOW (HIGH) RP = HIGH POWER-OFF
main supply
input Dx 0 to 300 ms 0 to 300 ms
1 to 20 ms RP = LOW
MGR213
Fig.19 Behaviour after missed I2C-bus read sequence.
2004 Jan 15
23
Philips Semiconductors
Product specification
On/off logic IC
ON/OFF LOGIC WITH SWITCHED MICROCONTROLLER SUPPLY
SAA1305T
14 V handbook, full pagewidth
5V CONTINUOUS REGULATOR
5V RES
21 9 10
ON/OFF
5V REGULATOR RESET WD CHI SDA SCL
5V
SAA1305T
D0 to D7
23 11 24
RP
MICROCONTROLLER
1 to 8
18 20
MGR214
Fig.20 Block diagram with switched microcontroller supply.
handbook, full pagewidth
14 V
RES
Dx
ON/OFF
ON/OFF
RP
RP
CHI
CHI
WD
(1)
WD
(1)
MGR215
a. First power-on.
(1) Level not defined.
b. Normal switch-on.
Fig.21 On/off description with switched microcontroller supply.
2004 Jan 15
24
Philips Semiconductors
Product specification
On/off logic IC
Scenarios for ON/OFF logic with switched microcontroller supply
SAA1305T
5 V continuous handbook, full pagewidth regulator RES = LOW 200 ms RES = HIGH
SAA1305T RP = HIGH
5 V regulator
microcontroller
ON/OFF = HIGH 6 ms 20 ms RP = LOW
RESET = HIGH CHI = LOW RESET = LOW
I2C-bus read status/old/new register CHI = HIGH I2C-bus write reset time/blink/LED status I2C-bus write ENABLE-RESET ON/OFF = LOW RESET = HIGH
MGR216
Fig.22 Proper first connection on power supply.
SAA1305T handbook, full pagewidth Dx RP = HIGH ON/OFF = HIGH 10 ms CHI = LOW RP = LOW
5 V regulator
microcontroller
RESET = HIGH RESET = LOW 6 ms
I2C-bus read status/old/new register CHI = HIGH WD = LOW 250 ms WD = HIGH 250 ms WD = LOW
MGR217
Fig.23 Switch-on after a valid input change.
2004 Jan 15
25
Philips Semiconductors
Product specification
On/off logic IC
SAA1305T
handbook, full pagewidth
SAA1305T
5 V regulator
microcontroller
input D0 = LOW TS = LOW 250 ms ON/OFF = LOW RP = HIGH CHI = LOW 10 ms ON/OFF = HIGH RP = LOW input D0 = HIGH(1) I2C-bus read status/old/new register CHI = HIGH WD = LOW 250 ms WD = HIGH 250 ms WD = LOW
MGR218
25 ms RESET = HIGH
(1) If input D0 = LOW, the microcontroller will restart the VL timer.
Fig.24 VL timer behaviour.
SAA1305T handbook, full pagewidth
5 V regulator
microcontroller
wrong or missed Watchdog timer trigger signal RP = HIGH 1 to 20 ms RP = LOW 300 ms CHI = LOW wrong or missed Watchdog timer trigger signal RP = HIGH 1 to 20 ms RP = LOW 300 ms wrong or missed Watchdog timer trigger signal ON/OFF = LOW 4 times
MGR219
Fig.25 Wrong or missed Watchdog timer trigger.
2004 Jan 15
26
Philips Semiconductors
Product specification
On/off logic IC
PACKAGE OUTLINE
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SAA1305T
SOT137-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 A1 pin 1 index Lp L 1 e bp 12 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.1 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 15.6 15.2 0.61 0.60 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.05 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 Z
(1)
0.9 0.4
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
0.035 0.004 0.016
8 o 0
o
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT137-1 REFERENCES IEC 075E05 JEDEC MS-013 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
2004 Jan 15
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Philips Semiconductors
Product specification
On/off logic IC
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: * below 225 C (SnPb process) or below 245 C (Pb-free process) - for all BGA, HTSSON-T and SSOP-T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages. * below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. Wave soldering
SAA1305T
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
2004 Jan 15
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Philips Semiconductors
Product specification
On/off logic IC
Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE(1) BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA, USON, VFBGA DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(5), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L(8), PMFP(9), WQCCN..L(8) Notes not suitable not suitable(4) suitable not not recommended(5)(6) recommended(7)
SAA1305T
SOLDERING METHOD WAVE REFLOW(2) suitable suitable suitable suitable suitable not suitable
not suitable
1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 5. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. 9. Hot bar or manual soldering is suitable for PMFP packages.
2004 Jan 15
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Philips Semiconductors
Product specification
On/off logic IC
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION
SAA1305T
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2004 Jan 15
30
Philips Semiconductors
Product specification
On/off logic IC
PURCHASE OF PHILIPS I2C COMPONENTS
SAA1305T
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
2004 Jan 15
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Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2004
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R32/02/pp32
Date of release: 2004
Jan 15
Document order number:
9397 750 12586

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